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  • M. Nickel, L. Kalms, T. Häring and D. Göhringer, “High-Performance AKAZE Implementation Including Parametrizable and Generic HLS Modules“, 2022 IEEE 33rd International Conference on Application-specific Systems, Architectures and Processors (ASAP), doi: 10.1109/ASAP54787.2022.00031.

 

  • Julian Demicoli, Laurin Prenzel, Sebastian Steinhorst. “Autonomous Hyperloop Control Architecture Design using MAPE-K“. In: Proceedings of the Conference on Design, Automation and Test in Europe.

 

  • Julian Demicoli, Nicolai Palm, Herbert Palm, Oliver Kleikemper, and Sebastian Steinhorst, “Autonomous Vehicular Systems: Architectural Strategies for Adaptive Multi-Objective Configuration”, 2024 IEEE 99th Vehicular Technology Conference. 

 

  • Julian Demicoli,”Systematic Optimization of Electromagnet Hardware for Electromagnetic Suspension: A Fusion of Simulation and Multi-Objective Optimization Techniques“, 2024 IEEE International Magnetics Conference.

 

  • Tobias Tiedje, Krzysztof Nieweglowski, Karlheinz Bock, “Effects of Silanated Glass Particles as Photo Resin Filler to Embed Electronic Components”, in 46th International Spring Seminar on Electronics Technology (ISSE), Timisoara, 2023​.

 

  • Tobias Tiedje, Christoph Bräuer,  Marco Luniak, Krzysztof Nieweglowski, Karlheinz Bock, “Stereolithographic process for embedding of electronic components into multi-material flexible and stretchable polymer substrate to reduce stress during stretching,” in Advancing Microelectronics Magazine: The Future Advanced Packaging Workforce – Student Talent in our High Schools and Universities, Vol. 50, No. 4, 2023.

 

  • D. Prousalis, V. Ntinas, I. Messaris, A. S. Demirkol, A. Ascoli, and R. Tetzlaff, “​Dynamics of a Memristive Bridge with Valence Change Mechanism (VCM) Devices”, ” 2023 IEEE International Symposium on Circuits and Systems (ISCAS), Monterey, CA, USA, 2023, pp. 1-5​.

 

  • Guo, Liyuan and Jobst, Matthias and Partzsch, Johannes and Scholze, Stefan and Dixius, Andreas and Lohrmann, Matthias and Zeinolabedin, Seyed Mohammad Ali and Mayr, Christian, “A Low-Power Hardware Accelerator of MFCC Extraction for Keyword Spotting in 22nm FDSOI,” 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), Hangzhou, China, 2023, pp. 1-5, doi: 10.1109/AICAS57966.2023.10168587.

 

  • F. M. Schüffny, S.M.A. Zeinolabedin, R. George, L. Guo, A. Weiße, J. Uhlig, J. Meyer, A. Dixius, S. Hänzsche, M. Berthel, S. Scholze, S. Höppner, C. Mayr, A 64-channel back-gate adapted ultra-low-voltage spike-aware neural recording front-end with on-chip lossless/near-lossless compression engine and 3.3V stimulator in 22nm FDSOI. IEEE A-SSCC 2022, pp. 1-3, doi: 10.1109/A-SSCC56115.2022.9980793.

 

  • H, Gonzalez, B. Vogginger, C. Liu, M. Stolba, F. Kelber, H. Bauer, S. Hänzsche, S. Scholze, M. Berthel, T. Rosmeisl, L. Guo, D. Walter, P. Das, K. K. Nazeer, T. Schubert, S. Höppner, C. Mayr , A 12-ADC 25-Core Smart MPSoC Using ABB in 22FDX for 77GHz MIMO Radars at 52.6mW Average Power. IEEE CICC 2023, San Antonio, Texas.

 

  • H. A. Gonzalez, C. Liu, B. Vogginger, S. Höppner, C. Mayr, Cognitive FMCW radar to enhance velocity disambiguation in MIMO systems. RADAR 2022, pp. 95-100, doi: 10.1049/icp.2022.2298.

 

  • B. Vogginger, F. kreutz, J. Lopez-Randulfe, C. Liu, R. Dietrich, H. Gonzalez, D. Scholz, N. Reeb, D. Auge, J. Hille, M. Arsalan, F. Mirus, C. Grassmann, A. Knoll, C. Mayr, Automotive radar processing with spiking neural networks: Concepts and challenges. Frontiers in Neuroscience 2022, 16, 851774, DOI: 10.3389/fnins.2022.851774. 

 

  • Marco Liess, Julian Demicoli, Tobias Tiedje, Matthias Lohrmann, Matthias Nickel, Marco Luniak, Dimitris Prousalis, Thomas Wild, Ronald Tetzlaff, Diana Göhringer, Christian Mayr, Karlheinz Bock, Sebastian Steinhorst, Andreas Herkersdorf, “X-MAPE: Extending 6G-connected Self-adaptive Systems with Reflexive Actions” in 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks (NFV-SDN), 2023.

 

  • Hector A. Gonzalez and Jiaxin Huang and Florian Kelber and Khaleelulla Khan Nazeer and Tim Langer and Chen Liu and Matthias Lohrmann and Amirhossein Rostami and Mark Schöne and Bernhard Vogginger and Timo C. Wunderlich and Yexin Yan and Mahmoud Akl and Christian Mayr, “SpiNNaker2: A Large-Scale Neuromorphic System for Event-Based and Asynchronous Machine Learning”, arXiv:2401.04491, 2024.

 

  • F. M. Schüffny, S. Höppner, S. Hänzsche, R. M. George, S. M. Ali Zeinolabedin, C. Mayr, “Power Minimisation in Neural Recording Σ Modulators by Adaptive Back-Gate Voltage Tuning,” 2023 IEEE SSC-L. Doi: 10.1109/LSSC.2023.3270243.

 

  • F. M. Schüffny, S. Hänzsche, S. Henker, S. M. Ali Zeinolabedin, S. Scholze, S. Höppner, R. M. George, C. Mayr, “A 3.3V Saturation-Aware Neurostimulator with Reset Functionality in 22nm FDSOI,” 2023 IEEE Interregional NEWCAS Conference. 

 

  • L. Guo, S. M. Ali Zeinolabedin, F. M. Schüffny, A. Weiße, S. Scholze, R. George, J. Partzsch, C. Mayr, “A 16-channel Real-time Adaptive Neural Signal Compression Engine in 22nm FDSOI,” 2023 IEEE Interregional NEWCAS Conference.

 

  • Tiedje, T., Bräuer, C., Luniak, M., Nieweglowski, K., & Bock, K., “Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching,” 2024, Journal of Microelectronics and Electronic Packaging, 21(1), 9-13.

 

  • T. Tiedje, C. Bräuer, M. Luniak, K. Nieweglowski, K. Bock, “Herstellungsverfahren eines multimateriellen dehnbaren Substrates mit eingebetteten elektrischen Komponenten,” in Tagungsband: Elektronische Baugruppen und Leiterplatten EBL 2024, 167-172.

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