Title: Prof. Dr.-Ing. Dr. h. c. mult.
6G-life Position: Principal Investigator
University: TU Dresden – Chair for Electronics Packaging
Phone: +49 (0)351 46336345
WP 3.5 Adaptive Microelectronics and Network Hardware
Karlheinz Bock gained scientific experience in the areas of semiconductor technology, electronics packaging, heterogeneous system integration, micro integration, related materials and quality and reliability, and science and technology management at the Universities of Saarbrücken and Darmstadt, at the Tohoku University Sendai Japan, at IMEC in Belgium, at the Fraunhofer Management Society with Roland Berger in Munich, at the Fraunhofer IZM and EMFT in Berlin and Munich. From 2007 until 2014 he served as W3 professor for Polytronics Systems at the University (TU) Berlin. Since October 2014 he serves as professor for electronics packaging and director of the Institute for Electronics Packaging (IAVT) at the University of Dresden (TU Dresden). He presently serves as dean of the faculty electronics engineering and information sciences. He is a member of IEEE (M’95, SM’17).He serves on the board of governors of the IEEE electronics packaging society EPS for region 8 since 2014-2018 and from 2020 until 2023. Please see Google Scholar or Research Gate profiles for full publication history.